There’s an upgraded LG G3 model reportedly in the works and the company looks to be clearing a path for the phone’s launch. The handset recently received Bluetooth certification and it was spotted under the model number LG-F460S where the letter ‘S’ reportedly stands for SK Telecom.
The phone was previously leaked as the LG-F460L which suggests that it will be headed to operator LG+ as well, notes PhoneArena. Like the Samsung Galaxy S5 LTE-A, the LG G3 Prime will most likely be exclusive to the Korean market. And while the BluetoothSIG website doesn’t provide much information about the device, rumor has it that the phone will feature Qualcomm’s latest Snapdragon 805 chipset along with LTE-A network support.
The SOC will most likely be clocked at 2.5GHz with Adreno 420 graphics onboard. Apart from this, it will be clubbed together with the MDM9635 modem that supports downlink speeds of up to 225Mbps. Except for the change of heart (read: Processor), there isn’t likely to be any major modifications to the specs. However, we could see the smartphone offer IP67 dust and water resistance. This would mean that the rear panel will no longer be removable unless LG implements a similar technique like Samsung did with its S5 flagship.
Here’s a look at the rumored LG G3 Prime specs:
– Snapdragon 805 SOC
– 5.5-inch QHD display
– 3GB RAM
– 32GB storage, 128GB expandable
– Android 4.4 KitKat
– IP67 dust- and water-resistant design
– 13MP rear camera w/ laser AF
The LG G3 Prime is expected to be unveiled sometime this month.