While the Medfield platform is giving the ARM Cortex A9 a tough fight, the Intel SMARTi UE2p SOC targets the budget-friendly segment, seemingly waging war against the low-power ARM processors. The Santa Clara-based chip maker’s main objective here is to deliver a cost-effective way of implementing HSPA connectivity in entry-level smartphones.
Not only does the SOC intend to reduce the total cost of ownership, but also the complexity faced by developers by enabling a smaller footprint. The chip basically flaunts a single 65nm silicon die design and it can be integrated with the company’s own SMARTi UE2 3G HSPA radio frequency transceiver along with 3G power amplifiers.
“The SMARTi UE2p will simplify the product development and supply chain logistics with the reduction in component count and system complexity,” commented Stefan Wolff, vice president of the Intel Architecture Group and general manager of Multi-Com. “This will allow our customers to introduce lower-cost 3G handsets and support the transition of the machine-to-machine market segment toward 3G-based connected devices to help enable the ‘Internet of things.”
Since energy conservation is one of the main goals here, a power management utility is integrated onto the chip along with sensors that provide a direct access line to the device’s battery. The SOC can also be implemented alongside the Intel XMM62xx HSPA slim modem family through support for multiple 3G dual band configurations, enabling global use.
Currently, there are no specific details as to when handsets are likely to surface bundled with the Intel SMARTi UE2p SOC. However, interested chip buyers will be able to grab a few samples sometime during the fourth quarter of 2012.