Mattson unveils high-speed strip tool
Mattson Technology Inc. manufacturers of semiconductor equipments have developed a new dry strip system that apparently has the highest throughput in the industry.
According to Mattson the 300-mm Suprema strip system is founded on a flexible, modular design that makes it best suited for both development and production environments.
The dry strip system features vacuum and atmospheric robotics which deliver increased throughput of more than 300 wafers per hour. This represents more than a 40 percent improvement compared to competitive systems for bulk strip applications.
Mattson said suprema’s proprietary inductively coupled plasma source provides increased strip rates of over 9 microns/minute. Its vacuum robot uses a transfer mechanism, capable of transferring four wafers concurrently, to minimize overhead time. Suprema can be configured with two dual-wafer modules.
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