Tech Shout!

On Friday, IBM announced that it had started shipping the first processor chips planned to be used in its next-gen ‘Wii’ gaming console. The chips, code-named Broadway and manufactured in New York, are based on IBM’s Power architecture using 90 nanometer fabrications.

IBM claims the underlying technology of the chips called silicon-on-insulator will deliver significantly more power with a 20% energy saving.

IBM’s processors can now be found in every next-generation console. The Wii includes a processor based on the PowerPC architecture; Microsoft’s Xbox 360 is a triple-core PowerPC processor running at 3.2GHz; and Sony’s PlayStation 3 includes a cell processor that IBM co-developed with Sony and Toshiba.

Nintendo’s Senior R&D Managing Director and General Manager Genyo Takeda said, “The first chips are in our possession.” Takeda added. “Today’s milestone marks the final stage of our drive to reach both core and nontraditional gamers with an inviting, inclusive and remarkable gaming experience.”

Nintendo’s agreement with IBM calls for millions of the chips to be produced, which would employ IBM’s power-saving Silicon on Insulator technology. All processors would be produced at the company’s East Fishkill, N.Y. production facility.

“The IBM team has worked hard to design, develop and deliver this customized Power microprocessor for the worldwide launch of Nintendo’s new system,” IBM Technology Collaboration director Ron Martino said.

The Wii is expected to ship around the same time as the PlayStation 3, and retail for under $250 USD. Its low price alone may put a serious dent into the sales of the Xbox 360 and PlayStation 3, which retail for as much as two or three times the Wii’s base price.

This is not the first time that the two companies have worked together. In 1999, IBM negotiated an agreement to produce the “Gekko” chip at the heart of the Nintendo GameCube console.